DDC offers a wide range of radiation-hardened memory products, including PROM, EEPROM, SRAM, SDRAM, and NOR & NAND flash. Any of these products are available either with DDC's proprietary RAD-PAK® shielding, or in rad-tolerant packages. RAD-PAK® is a hermetic ceramic package shielding technology that reduces the Total Ionizing Dose (TID) received by the semiconductor components in the package by orders of magnitude from the total ionizing dose environment exterior to the package. This allows us to put commercial semiconductors with only moderate total dose tolerance in the high total dose environments encountered in space. Rad-tolerant devices are available in a hermetic ceramic package with a guaranteed TID tolerance at the die level. The EEPROM are also available in DDC's proprietary Xray-PAK® shielding, a hermetic ceramic package shielding technology that eliminates any line-of-sight radiation penetration to the semiconductors inside the package. This allows the effective shielding of x-rays from a nuclear weapon.
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